LOCTITE® ABLESTIK 2815A
Features and Benefits
LOCTITE ABLESTIK 2815A, Acrylate, Die Attach
LOCTITE® ABLESTIK 2815A die attach adhesive is designed to minimize thermal resistance between the chip and substrate. It provides improved workability for applications requiring high heat extraction from die.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 64.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| RT die shear strength | 5.8 kg-f |
| Tensile modulus, @ 250.0 °C | 1600.0 N/mm² (230000.0 psi ) |
LOCTITE® ABLESTIK 2815A
LOCTITE ABLESTIK 2815A, Acrylate, Die Attach