BERGQUIST® GAP FILLER TGF 4500CVO
Features and Benefits
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature, but the cure rate can be accelerated by applying heat.
- Thermal conductivity: 4.5 W/mK
- Extended working time for manufacturing flexibility
- Controlled volatile silicones
- High dispensing rate
Documents and Downloads
Looking for a TDS or SDS in another language?
Additional Documents
Technical Information
Cure type | Heat cure, Room temperature (ambient) cure |
Operating temperature | -60.0 - 200.0 °C |
Shelf life, @ 25.0 °C | 180.0 day |
Thermal conductivity | 4.5 W/mK |