BERGQUIST® GAP FILLER TGF 4500CVO
Caractéristiques et avantages
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature, but the cure rate can be accelerated by applying heat.
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Informations techniques
| Conductivité thermique | 4.5 W/mK |
| Durée de conservation, @ 25.0 °C | 180.0 jour |
| Température de service | -60.0 - 200.0 °C |
| Type de polymérisation | Polymérisation par la chaleur, Polymérisation à température ambiante |
BERGQUIST® GAP FILLER TGF 4500CVO
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.