BERGQUIST® GAP PAD TGP 2400
Conhecido como Gap Pad® 2500S20
Características e Benefícios
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.
BERGQUIST® GAP PAD® TGP 2400 is a pre-cured, silicone-based thermally conductive, reinforced gap pad. This product is highly conformable and exhibits thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
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Informação Técnica
| Capacidade de calor, ASTM E1269 | 1.0 J/g-K |
| Classificação da chama | V-0 |
| Condutividade térmica | 2.4 W/mK |
| Constante dielétrica, @ 1kHz | 6.6 |
| Cor | Amarelo-claro |
| Densidade | 3.1 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 | 20.0 |
| Espessura padrão | 0.254 - 6.35 mm |
| Resistividade volumétrica | 1×10 Ohm m |
| Tensão de ruptura dielétrica | 3000.0 Vac |
BERGQUIST® GAP PAD TGP 2400
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.