Thermally Conductive Adhesives

Robust heat conducting adhesives with strong bonding performance

Formulated in multiple mediums, Henkel’s thermally conductive silicone adhesives and thermally conductive epoxy adhesives deliver on two fronts: facilitation of thermal management objectives and the elimination of space-restrictive mechanical fasteners. Creating a strong bond and attaching a component to a heat sink, Henkel thermally conductive adhesives in pad, liquid and laminate mediums allow reliable, long-lasting connection and effective heat dissipation. With the ability to automate application via dispensing or custom placement solutions, Henkel thermal adhesives offer the ultimate in cost-efficiency and performance.

Versatile Materials for Thermal Performance

Tape Adhesives

The BOND PLY^® family of materials are thermally conductive and electrically isolating. BOND PLY^® materials, available in PSA or laminating formats, provide for the decoupling of bonded materials with mismatched coefficients of thermal expansion. BOND PLY^® delivers:

A replacement to heat cure adhesives
A screw mounting and clip mounting alternative

Film Adhesives

When there is a requirement for bonding large areas or joining complex parts, thermal adhesive films are the preferred materials. Larger bonding areas are problematic for liquid-based mediums as voids may result; films, however, deliver uniform, void-free bondlines and controlled thicknesses. Supplied in custom, pre-cut formats, Henkel’s line of thermal adhesive films offers a clean, waste-free, easily-processed solution with a low total, cost of ownership in thermally and electrically-conductive formulas.

Liquid Adhesives

Henkel’s liquid adhesives — sometimes referred to as thermally conductive 'glue' — provide robust mechanical attachment, allowing for the elimination of fasteners such as screws and clips, which also helps reduce device size and weight to align with electronics miniaturization protocols. These form-in-place elastomers are ideal for coupling PCB-mounted heat-producing electronic components with an adjacent metal case or heat sink. With the ability to maintain thin bondlines and excellent thermal paths, LOCTITE^® and BERQUIST^® brand liquid adhesives enable excellent thermal management performance and the ability to automate application through the use of automatic dispensing systems.