BERGQUIST® GAP FILLER TGF 4400LVO
Características y Ventajas
This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler for control units and ADAS components offers highly reliable thermal management and robust processing.
BERGQUIST® GAP FILLER TGF 4400LVO is a silicone, 2-part, room-temperature curable gap filler, ideal for a wide range of electronic assembly applications. With 4.4 W/(m.K) thermal conductivity and the possibility to achieve thin bondlines, it provides an excellent and versatile solution for optimizing heat dissipation in demanding applications. Its superior mechanical stability offers reliability and consistency in harsh operating conditions over the entire lifetime of electronics components. Perfect for use in automotive, industrial, and consumer applications.
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Información técnica
| Características principales | Conductividad: Conductor Térmico |
| Forma física | Líquido |
| Número de componentes | Bicomponente |
BERGQUIST® GAP FILLER TGF 4400LVO
This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler for control units and ADAS components offers highly reliable thermal management and robust processing.