LOCTITE® ABLESTIK 84-1LMIT

Features and Benefits

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LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing.
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Technical Data Sheet
LOCTITE® ABLESTIK 84-1LMIT
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Technical Information

Cure schedule, @ 150.0 °C 1.0 hr.
Cure type Heat cure
Number of components 1 part
Physical form Paste
Storage temperature -40.0 °C
Volume resistivity, @ 150.0 °C 0.00009 Ohm cm