TECHNOMELT® PA 652
Features and Benefits
Hotmelt adhesive used for moulding applications, good for low pressure moulding and encapsulation. Good adhesion and cold temperature flexibility. Very short open time.
TECHNOMELT® PA 652 is an amber-colored, polyamide hotmelt adhesive used for low pressure moulding and encapsulation - UL-listing (V-0). It provides excellent adhesion, cold temperature flexibility, wide chemical resistance and excellent thermal durability characteristics. Its low melt temperature and very short open time are ideal for the production environment.
- Operating temperature: -40ºC to 100ºC (-40ºF to 212ºF)
- Solvent-free
- Cost effective alternative to epoxy potting
- Excellent adhesion and cold temperature flexibility
- Ideal for low pressure moulding
Documents and Downloads
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Technical Information
| Colour | Amber |
| Density | 0.98 g/cm³ |
| Elongation, at break | 400.0 % |
| Melt viscosity, Brookfield - RVT, ASTM D 3236 @ 180.0 °C Spindle 27 | 9500.0 mPa·s |
| Operating temperature | -40.0 - 100.0 °C |
| Physical form | Liquid |
| Shore hardness, ISO 868/15s Shore A | 77.0 |
| Softening point temperature | 157.0 - 165.0 °C |
| Viscosity | 4000.0 mPa·s (cP) |
TECHNOMELT® PA 652
Hotmelt adhesive used for moulding applications, good for low pressure moulding and encapsulation. Good adhesion and cold temperature flexibility. Very short open time.