LOCTITE® 3609
Features and Benefits
Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.
- Particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required
- Designed for bonding surface mounted devices to printed circuit boards prior to wave soldering
- One component - requires no mixing
- Can be used in lead free wave solder with both water-based and alcohol-based fluxes
Documents and Downloads
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Technical Information
| Colour | Red |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Gel |
| Shear strength, Steel (grit blasted) | 1450.0 psi |
| Storage temperature | 2.0 - 8.0 °C |
| Viscosity, cone & plate Haake PK100, M10/PK1, 2° | 0.16 - 20.0 Pa∙s |
LOCTITE® 3609
Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering.