White Papers and Technical Papers

The rapid advancements in artificial intelligence (AI) and high-performance computing (HPC) have underscored the critical role of advanced semiconductor packaging. Over the past decade, substantial progress in 2.5D and 3D heterogeneous integration has been achieved, enhancing I/O capacity, performance, cost-efficiency, power reduction, and signal speed. These developments have been crucial for handling massive data processing demands. As these technologies evolve, ensuring the reliability and protection of increasingly large and complex die within these packages has become paramount.

How the chemical industry can make a difference by leading the transition to renewable carbon

Processing Solutions for Battery Electric Vehicles; Download Henkel's white paper on cleaners, lubricants and surface treatment for BEVs

Get in-depth expertise about sustainability topics for the metals industry.

Download Henkel's white paper on the use of automotive ADAS Camera

Download the brochure to learn more about enabling next-generation EV batteries with thermally conductive adhesives.

Request Henkel's white paper on high crash-resistant structural adhesives for increased lightweighting and crash performance.

Lightweighting is becoming more and more important in automotive design, driven by both the weight of batteries in EV’s and its fuel-saving effects in traditional vehicles. Through lightweighting a vehicle can expend less energy to extend the range while maintaining the structure performance. To achieve lightweighting, manufacturers are optimizing the car body through new engineered solutions that both optimize design and cost effectivity and sustainability.

Get first-hand in-depth knowledge on aerospace innovations