BERGQUIST® TGF 3010APS
Features and Benefits
This highly thermally conductive liquid gap filler has easy, fast dispensing and low stress assembly, and is ideal for high throughput applications like EV battery applications and automotive power storage systems.
BERGQUIST® GAP FILLER TGF 3010APS is a silicone-free, 2-part gap filler with a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and room temperature cure. It is designed for low-stress silicone sensitive application, avoiding damage during battery module assembly. A great product when you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress.
- Very high dispense rate
- Low compression force
- Room temperature cure
- High thermal conductivity of 3 W/mK
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Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -40.0 - 80.0 °C |
| Thermal conductivity | 3.0 W/mK |
| Mixed | |
| Color, Mixed | Black |
| Resin | |
| Color, Resin | Black |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® TGF 3010APS
This highly thermally conductive liquid gap filler has easy, fast dispensing and low stress assembly, and is ideal for high throughput applications like EV battery applications and automotive power storage systems.