Automated 2-Component Potting – The Industry Standard in Many Sectors
Through the automated application process for electronics or electronic parts are potted or encapsulated using 2-component cast resins. The potting hardens at room temperature and supports the integrity of the final parts. Potting material is also used for circuit boards which are covered with a potting layer, or component surfaces covered with a transparent protective coating.
The main advantage is that potting can be achieved through fully or partly automated processing and dispensing. The part application can be carried out in an economical and reliable fashion with a fully automatic SONDERHOFF mixing and dosing machine.
The chemical basis of the 2-component cast resin systems used for this are polyurethane (PUR), polyurethane-epoxy mixes or silicones. The chemical and mechanical properties of these plastics can be varied over a broad spectrum. Therefore, potting is suited to a wide range of applications.
Once the potting has cured, it protects electrical and electronic parts from damp, dust, dirt, temperature, shock, and accidental contact. Furthermore, potting can be used for copy protection, and it improves electrical insulation and can be formulated flame-retardant.