LOCTITE® ECCOBOND EN 3839
Features and Benefits
LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top
LOCTITE® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing.
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Technical Information
| Applications | Encapsulating |
| Coefficient of thermal expansion (CTE), Above Tg | 211.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 108.0 ppm/°C |
| Colour | Light blue |
| Cure schedule light intensity | 2000.0 mJ/cm² |
| Cure schedule, @ 130.0 °C | 10.0 min. |
| Cure type | UV cure |
| Glass transition temperature (Tg) | 26.0 °C |
| Shelf life | 180.0 day |
| Shore hardness, Shore D | 27.0 |
| Storage modulus, DMA @ 25.0 °C | 334.0 N/mm² (48400.0 psi ) |
| Storage temperature | -20.0 °C |
| Thixotropic index | 4.1 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 7800.0 mPa·s (cP) |
LOCTITE® ECCOBOND EN 3839
LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top