LOCTITE® ECCOBOND BF 4
Features and Benefits
LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.
LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.
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Technical Information
| Applications | Die attach |
| Colour | Black |
| Cure schedule, @ 100.0 °C | 30.0 min. |
| Glass transition temperature (Tg) | 94.0 °C |
| Number of components | 1 part |
| Shear strength | 24.0 kg-f |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 23500.0 mPa·s (cP) |
LOCTITE® ECCOBOND BF 4
LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.