LOCTITE® ABLESTIK QMI509
Features and Benefits
LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive
LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also exhibits a very low modulus, which can reduce inter-package stress. A package or device manufactured with LOCTITE ABLESTIK QMI509 will have good resistance to delamination and “popcorning” after exposure to reflow temperatures. LOCTITE ABLESTIK QMI509 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 77.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 168.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 1.0 °C |
| Thermal conductivity | 2.8 W/mK |
| Thixotropic index | 3.5 |
| Viscosity | 8500.0 mPa·s (cP) |
LOCTITE® ABLESTIK QMI509
LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive