LOCTITE® ABLESTIK 2958
Features and Benefits
LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing
LOCTITE® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications that require superior electrical and mechanical properties. It is free of contaminating solvents and additives and develops strong durable seals and coatings.
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Technical Information
| Cure schedule, @ 125.0 °C | 5.0 min. |
| Cure type | Heat cure |
| Number of components | 2 part |
| Operating temperature | -60.0 - 175.0 °C |
| Shear strength, Aluminium | 1000.0 psi |
| Storage temperature | 27.0 °C |
| Thixotropic index | 2.9 |
| Volume resistivity, 2 min. @ 150°C | 0.0005 Ohm cm |
| Volume resistivity, 5 min. @ 125 °C | 0.0003 Ohm cm |
| Mixed | |
| Viscosity, Mixed @ 25.0 °C | 40000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2958
LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing