Increased demand for streaming services, data storage, analytics and cloud-based applications are driving the requirement for next-generation high-speed network access and data processing capabilities across cities, countries and continents. To manage these accelerating data rates and volumes, the industry is transitioning to the 400 Gigabit Ethernet (GbE) standard -- which incorporates a range of modules including 400ZR -- for faster switching and routing. Optical transceivers are the backbone of data movement; meeting the needs of all types of 400 GbE module assembly and reliability is critical and why more companies are choosing Henkel when it comes TOSA/ROSA assembly materials.
Material Solutions for High Performance Optical Trasnceiver Applications
Transceiver Applications
Optical Sub-Assembly (OSA)
- Active Alignment & Bonding Adhesives
- Structural Adhesives
Active Alignment and Bonding Adhesives: An optimized active optical alignment process enables highly accurate and cost-effective production of optical sub-assemblies (TOSA, ROSA) in optical transceivers. Henkel’s dual-cure UV adhesives are designed to precisely align these optical components by providing low shrinkage, low CTE, good light transmittance, high reliability and improved dispensing life.
Structural Adhesives: LOCTITE brand structural adhesives are available in a range of different chemistries to accommodate process preferences and requirements and deliver compatibility with various substrates including metals and plastics. This flexibility and broad adhesion capability enables numerous applications including optical transceiver PCB, front cover and housing bonding, among others.
LOCTITE® ECCOBOND LUX AA50T
LOCTITE® ECCOBOND LUX 3042M
LOCTITE® HHD 4042
Optical Fiber Adhesives
Epoxy adhesive formulations provide strong bonding for most substrates, and ensure limited fiber displacement and proper termination for optimal light transmission with minimal data loss.
LOCTITE ABLESTIK 2170
LOCTITE 3703
Die-Attach Adhesives
LOCTITE® ABLESTIK® one-component, low-bleed, low-outgassing, high-performance, high-reliability conductive die attach adhesives and semi-sintering materials are ideal for laser diode bonding.
LOCTITE® ABLESTIK 8068TA
LOCTITE® ABLESTIK 84-1LMI
LOCTITE® ABLESTIK 8910T
LOCTITE® ABLESTIK 2030SC
LOCTITE® ABLESTIK 8068TB
LOCTITE® ABLESTIK 84-1LMISR4
LOCTITE® ABLESTIK 84-3
Thermal Gel
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability and reliability in challenging environments.
BERGQUIST® LIQUI-FORM TLF 6000HG (6W/mK)
Gap Pad®
Low modulus, high thermal conductivity, silicone-free BERGQUIST GAP PAD® are highly conformable, provide low assembly stress and optimize thermal performance for ICs in optical components and devices.
BERGQUIST GAP PAD® TGP EMI1000 (1W/mK)
BERGQUIST GAP PAD® TGP 3004SF (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 6000ULM (6W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
EMI Shielding / Gasketing
Electrically and thermally conductive flexible silicones are ideal for bonding and gasketing of EMI/RF-shielded enclosures.
LOCTITE® SI 5421
LOCTITE® ABLESTIK 59C
LOCTITE SI 5084
LOCTITE SI 5210
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® 3517M
LOCTITE® ECCOBOND UF 3812
Laser Diode Bonding
Laser diodes are the most common type of lasers produced and have a wide range of uses including fiber optic communication applications. Henkel’s die-attach portfolio, including high thermal semi-sintering materials, enables the reliable connection of these devices.
Optical Sub-Assembly (OSA)
A precise active optical alignment process enables accurate, cost-effective production of optical sub-assemblies such as TOSA, ROSA, BOSA. Henkel’s dual-cure UV adhesives are designed to precisely align optical components and secure their long-term performance through stability-enhancing attributes such as low shrinkage, low CTE, good light transmittance, low moisture absorption and high reliability.
Structural Bonding
LOCTITE® structural adhesives are used throughout optoelectronics devices to facilitate lens bonding and sealing, PCB to lid bonding, and front cover and housing bonding, among other applications. Available in a range of different chemistries to accommodate process preferences, LOCTITE® adhesives are compatible with multiple surfaces including metals, glass and plastics.
Thermal Management
As power densities increase alongside higher bandwidth performance, transceivers and other optical modules require high performance thermal control to remove heat for optimum performance. Available in liquid, gel and pad mediums, award-winning BERGQUIST thermal interface materials allow for broad design and assembly flexibility while also providing effective heat management within optical modules.
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