Henkel Thermal Management, Interconnect and Protection Materials on Show at SMT Hybrid Packaging 2018

May 21, 2018  Düsseldorf / Germany – Exhibiting in Hall 4, Booth 4-241 with distributor partner AAT Aston, Henkel Adhesive Electronics brings a wide range of enabling electronics assembly materials to the SMT Hybrid Packaging show, taking place June 5 – 7, 2018.

The company will highlight its latest dual-function Technomelt^® product, thermal interface material (TIM) innovations and award-winning solder formulations, as well as take part in two panel discussions that focus on the importance of solder capability for void and defect reduction.

Substrate protection and thermal management
Show delegates interested in learning more about the simplicity and effectiveness of Henkel’s Technomelt low pressure molding materials should plan to see live demonstrations of the thermally-conductive Technomelt TC 50 at the AAT Aston stand in Hall 4, Booth 4-241. Utilizing an LPMS low pressure molding system, Henkel technical experts will illustrate the ease of the three-step overmolding process, which encapsulates substrates and circuitry to offer robust protection from various environmental factors. In addition to critical electronic safeguarding, Technomelt TC 50 also conducts heat. A streamlined replacement for conventional potting materials, Technomelt TC 50 provides >0.5 W/m-K thermal conductivity to dissipate heat through the encapsulating material.

Capable thermal management is critical for the performance and reliability of modern electronic devices in multiple sectors such as lighting, automotive, consumer and industrial, among others. In addition to Technomelt TC 50, Henkel’s line of Bergquist thermal interface materials including award-winning Gap Pad products and liquid gap fillers, as well as thermal films and adhesives, will be on display at the SMT show. The broad portfolio comprises numerous material mediums and thermal conductivity levels to address a variety of applications, device architectures and production preferences.

Interconnect advances and expertise
As the market-leading developer of game-changing solder technologies, Henkel is looking forward to showcasing its portfolio of Loctite^® GC 10 temperature stable solder paste formulations with booth visitors. Since their introduction, multi-award-winning Loctite GC 10 and water-washable Loctite GC 3W have made thousands of assembly processes more cost-effective, reliable and stable by delivering high-performance and temperature stability throughout the entire logistics and production value chain.

The company’s solder know-how will also be featured during live show-floor Q&A sessions, as Henkel global technical expert, Richard Boyle, will take part in two solder-related discussion panels. The below expert roundtables are free to attend and hosted by Global SMT and Packaging magazine in Hall 4, Booth 4-520:

• Wednesday, June 6th, 10:00 a.m. – A Multi-disciplinary Approach to Void Reduction
  It is widely accepted that void reduction is best achieved through a combination of flux, alloy and soldering methodologies. The panel will discuss the merits of each and various techniques used to limit the formation of voids.
• Thursday, June 7th, 10:30 a.m. – Stencils and Avoiding Printing Defects
  Recognizing the impact that the printing process has on defect rates, the panel will discuss best practices used to minimize defects and errors. Insufficient paste, beading, paste types and storage, cleaning cycles and methodologies, step stencil production and more will be addressed.
  
  

To learn more about Henkel’s complete portfolio of electronics assembly and semiconductor solutions, visit Henkel Electronics.

Schedule an appointment with the Henkel team at SMT Hybrid Packaging by sending an e-mail to berit.hoffman@henkel.com or calling +49 (4101) 803-285.