BERGQUIST® GAP PAD® TGP 10000ULM
Lastnosti in prednosti
A high-performance, thermally conductive, silicone-based GAP PAD filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface characteristics, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.
Preberite več
Dokumenti in prenosi
Ali iščete tehnični list ali varnostni list v drugem jeziku?
Tehnične informacije
| Barva | Siva |
| Delovna temperatura | -60.0 - 200.0 °C |
| Toplotna prevodnost | 10.0 W/mK |
BERGQUIST® GAP PAD® TGP 10000ULM
A high-performance, thermally conductive, silicone-based GAP PAD filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).