Cloud and hyperscale data centers are increasingly more powerful and vital to our professional and personal lives than ever before. Enabling the transmission, routing and storage of valuable data – the currency of modern-day activities – is the primary role of data centers. Managing the exponentially growing volumes of generated bits and bytes is dependent upon the performance and reliability of data center systems and it's why more component and device designers rely on Henkel materials.
Securing valuable data for high-performance operations
Data Center Applications
Router/Switches
enRouters and switches integrate a variety of electronic and optical components, all designed as part of the network’s export layer where incoming and outgoing connections form the heart of data transfer. As the world moves in an increasingly digital direction, robust data center interconnect technology and higher data bandwidth needs are seeing the integration of 400 GbE solutions. Higher transfer speeds and power raise functional temperatures, creating a need for improved thermal management and system level cooling solutions. Leading BERGQUIST® and thermal interface material solutions provide multi-faceted approaches to heat management, offering holistic temperature control for the device and the system.
Phase Change
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. BERGQUIST® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease. Phase Change, Grease
LOCTITE® TCP 4000 D (3.4W/mK)
BERGQUIST® HI-FLOW THF 1600G (1.6W/mK)
Thermal Gel
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability and reliability in challenging environments.
LOCTITE® 315 (0.8W/mK)
LOCTITE® 3875 (1.75W/mK)
BERGQUIST® LIQUI-BOND TLB 400SLT
BERGQUIST® LIQUI-BOND TLB EA1800 (1.8W/mK)
BERGQUIST® LIQUI-BOND TLB SA3500 (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF LF3500 (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF 6000HG (6W/mK)
GAP PAD®
Low modulus, high conductivity BERGQUIST® GAP PADs provide excellent conformability and low stress thermal performance for IC devices not requiring a larger heat sink attachment.
BERGQUIST GAP PAD® TGP HC3000 (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 3000ULM (3W/mK)
BERGQUIST GAP PAD® TGP 3500ULM (3.5W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® 3517M
LOCTITE® ECCOBOND UF 3812
Micro-thermal interface coatings
Ultra-thin and durable, Bergquist micro-thermal interface coatings provide effective heat transfer between pluggable optical modules (POMs) and their riding heat sinks. The materials help reduce heat at a rate of 0.33 ° C per watt; as much as 5° C for a 15-watt module like those found in 400 Gb designs for high speed switching and routing systems.
BERGQUIST® microTIM MTIM 1013
BERGQUIST® microTIM MTIM 1029
Servers
enMedia streaming, 4K 360 video for VR/AR, data mining, analytics and a myriad of other data-rich applications continue to accelerate demand for high-performance computing capability. Not only are a greater quantity of CPUs and GPUs required for next-generation servers, but processing speeds and functionality expectations are also intensifying. Integration of these higher power density technologies make robust thermal control essential to enable performance at optimum levels to satisfy modern-day, data-driven application demands.
GAP PAD®
Low modulus, high conductivity BERGQUIST GAP PAD® provide excellent conformability and low stress thermal performance for IC devices not requiring a larger heat sink attachment.
BERGQUIST GAP PAD® TGP HC3000 (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 3000ULM (3W/mK)
BERGQUIST GAP PAD® TGP 3500ULM (3.5W/mK)
BERGQUIST GAP PAD® TGP 6000ULM (6W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
Thermal Gel
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability and reliability in challenging environments.
BERGQUIST® LIQUI-FORM TLF LF3500 (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF LF3800LVO (3.8W/mK)
BERGQUIST® LIQUI-FORM TLF 6000HG (6W/mK)
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® ECCOBOND UF 3812
Phase Change
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. BERGQUIST® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease. Phase Change, Grease
LOCTITE® TCP 4000 D (3.4W/mK)
BERGQUIST® HI-FLOW THF 1600G (1.6W/mK)
Storage
enMore capable storage capacity through advances in hard disk drives (HDDs) and solid-state drives (SSDs) is necessary to meet the performance demands of cloud-based storage and data analytics. Not only are these drive technologies more advanced and powerful than ever before, there are far more of them required in next-generation data centers in order to accommodate data storage and processing demands. With a higher quantity of HHDs and SSDs on a single line card, controlling the thermal load through effective heat dissipation is a key consideration for maximizing performance. There are multiple approaches to heat management strategy, and Henkel has the portfolio and the technical expertise to help design the best solution.
GAP PAD®
Low modulus, high conductivity BERGQUIST GAP PAD® provide excellent conformability and low stress thermal performance for IC devices not requiring a larger heat sink attachment.
BERGQUIST GAP PAD® TGP HC3000 (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 3000ULM (3W/mK)
BERGQUIST GAP PAD® TGP 3500ULM (3.5W/mK)
BERGQUIST GAP PAD® TGP 6000ULM (6W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
Thermal Gel
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability and reliability in challenging environments.
BERGQUIST® LIQUI-FORM TLF LF3500 (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF LF3800LVO (3.8W/mK)
BERGQUIST® LIQUI-FORM TLF 6000HG (6W/mK)
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® ECCOBOND UF 3812
Phase Change
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. BERGQUIST® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease. Phase Change, Grease
LOCTITE® TCP 4000 D (3.4W/mK)
BERGQUIST® HI-FLOW THF 1600G (1.6W/mK)
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