BERGQUIST® HI FLOW THF 700FT

BERGQUIST® HI FLOW THF 700FT reworkable thermal interface material provides a low thermal resistance path between hot components such as high performance processors and heat sinks. The material consists of a 55°C phase change compound bonded to one side of a conformable metal foil. This pressure sensitive material is easily applied to the heat sink and securely conforms to many mounting surfaces. Its compliant foil allows for easy release and reworking without leaving residue on CPU surfaces. Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 700FT wets-out the heat sink interface and flows to produce exceptional thermal performance. The thixotropic design of BERGQUIST HI FLOW THF 700FT requires pressure of the assembly to cause displacement and/or flow.