BERGQUIST® SIL PAD® TSP 3500
Znany jako Sil-Pad® 2000
Właściwości i korzyści
Thermally conductive, silicone insulator pad for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD TSP 3500 is a thermally-conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informacje techniczne
| Grubość standardowa | 0.254 - 0.508 mm |
| Klasa palności | V-0 |
| Kolor | Biały |
| Przewodność cieplna | 3.5 W/mK |
| Temperatura robocza | -60.0 - 200.0 °C |
| Typ nośnika | Włókno szklane |
BERGQUIST® SIL PAD® TSP 3500
Thermally conductive, silicone insulator pad for demanding aerospace and commercial applications. High cut-through, low thermal impedance.