Solutions To High-Power Advanced Semiconductor Packaging

In partnership with SEMICON Southeast Asia 2022 and in support of the global semiconductor community, Henkel – a conference sponsor – is pleased to share our latest discoveries in advanced packaging innovation. For those who want to know what the future holds for next-generation packaging designs and how to build reliable, high-performance devices, Henkel’s  presentation entitled “Material Solutions to the Challenges in Heterogeneous Integration” is a ‘must attend’ event.  Learn how new material formulations are helping meet automotive reliability and enable emerging high-powered electronics.   In this informative session, we will address these topics:

• Packaging technology has become a key enabler in markets including wireless, IoT, automotive, power management and computer networking.
• As compared to  system-on-a-chip (SoC) techniques, heterogeneous integration (HI) with advanced packaging technologies is a more attractive integration solution when considering of factors such as yield, performance, cost optimization,  and time-to-market.
• Understand the top challenges of heterogeneous integration and how  state-of-the-art materials enable advanced packaging technologies used in heterogeneous integration, including:  fine pitch flip-chip, wafer-level packaging (WLP), thermocompression bonding (TCB) and through-silicon vias (TSVs).
• Detailed discussion of an application study and reliability performance of pressure-less sintering technology.

Where and When

The SEMICON Southeast Asia 2022 Conference will be held in Penang, Malaysia.  The prestigious three-day event will focus on the sustainable electronics supply chain.  Industry leaders across market sectors  will gather to share their visions and technology roadmaps and discuss ways to deliver on the promise of groundbreaking technologies across the entire semiconductor value chain.

Date/Time: 22 June 2022 | 11:35 – 12:00 (GMT+8)
Where: Setia SPICE Arena & Convention Centre, Penang, Malaysia

HENKEL EXPERT SHARES INSIGHTS

Packaging innovation is integral to technology progress in  multiple markets including wireless, IoT, automotive, power management and computer networking. Join Dr. Wu Jie for this informative session about the material innovations enabling heterogeneous integration.

About the Speaker Dr. Wu Jie, Applications Engineering Senior Manager, Southeast Asia

Dr. Wu Jie has 12 years’ experience in the semiconductor packaging and assembly industry and has led the customer support experience for top integrated device manufacturers.  He holds a Ph.D. in micro-electromechanical system (MEMS).  In his current role, he leads a diverse Applications Engineering team in Southeast Asia, focusing on serving electronic accounts with Henkel bonding, connecting, sealing, coating, protection and thermal management solutions.  Dr. Wu also manages laboratories in Singapore and Vietnam to support customer failure analysis  and product development activities.

Presentation Topic: Material Solutions to the Challenges in Heterogeneous Integration