BERGQUIST® GAP FILLER TGF 2900LVO

BERGQUIST® GAP FILLER TGF 2900LVO is a silicone, 2-part room temperature curable gap filler suitable for use in a wide range of electronic assembly applications. With a thermal conductivity of 2.9 W/(m.K) and a possibility to achieve ultra-thin bondline thickness, it provides an excellent and versatile solution to optimize heat dissipation in challenging conditions. This material is an exceptional choice for the use in automotive, industrial and consumer electronic applications.