LOCTITE® ABLESTIK ABP 8065T

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LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Información técnica

Aplicaciones Unión
Coeficiente de dilatación térmica (CDT) 40.0 ppm/°C
Coeficiente de dilatación térmica (CDT), Above Tg 146.0 ppm/°C
Conductividad térmica 10.0 W/mK
Tipo de curado Curado Térmico
Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9000.0 mPa.s (cP)
Índice tixotrópico 6.0