Structure and Bonding Materials
Formulated to provide tough, durable bonds to a wide variety of surfaces
Durable structural assembly is central to the aesthetics, function and lifetime of consumer electronic devices. However, bonding the various components of the enclosure, sub-assembly and external decorative elements is becoming increasingly challenging, particularly given the variety of substrates used for each part of the structure
Henkel’s wide range of chemistry platforms – from polyurethane reactive hot melt (PUR) to methyl methacrylate (MMA), polyurethane (PU), cyanoacrylate (CA), epoxy and silicone adhesive for electronics – enables bonding dissimilar substrates, delivers process-friendly production, eliminates the need for tapes and screws, and helps prevent penetration of external contaminants like dust and water.
