LOCTITE® ABLESTIK CF 3350
Features and Benefits
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This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bond line adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
LOCTITE® ABLESTIK CF 3350 is a silver-filled flexible film adhesive with high electrical and thermal conductivity, as well as uniform bond line adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks.
- Uniform bond line adhesion
- High thermal and electrical conductivity
- Silver-filled
- Minimum thermal resistance to heat sink
Documents and Downloads
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Technical Information
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Physical form | Film |
| Thermal conductivity | 7.0 W/mK |
LOCTITE® ABLESTIK CF 3350
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bond line adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.