Join leading industry experts TechSearch International's, Jan Vardaman and Henkel's Davy Nakada to discuss market conditions driving new approaches to high thermal conductivity die attach materials and processes.
The increased demand for high-performance power devices highlights the need for better thermal control at the chip level. Combined with upcoming environmental regulations and challenging processes regarding existing materials, this has accelerated the need for easy-to-process, efficient die attach solutions to manage heat generated at the chip level.
Watch the following replay video below and contact us through the webform below to find out more about Henkel’s innovative ways to managing high thermal conductivity packages.