BERGQUIST® BOND PLY TBP 400B

BOND PLY product testing has been completed on various interface materials. These tests have demonstrated that improper surface wet-out is the single largest variable associated with maximizing bond strength and heat transfer. We have found that reducing the size of the interface pad to roughly 80% of the total interface area actually improves the overall bonding performance while offering significant improvements in total package cooling. Henkel offers three standard thicknesses for BERGQUIST® BOND PLY TBP 850, allowing each application to be optimized in three dimensions.

BERGQUIST® BOND PLY TBP 400B uses a dielectric film, replacing the fiberglass inherent in our BERGQUIST® BOND PLY TBP 850 series products. The addition of the film allows for high dielectric performance without additional product thickness

The answer to this varies from application to application, depending upon surface roughness and flatness. In general, pressure, temperature and time are the primary variables associated with increasing surface contact or wetout. Increasing the application time and/or pressure will significantly increase surface contact. Natural wet-out will continue to occur with BOND PLY materials. This inherent action often increases bond strength by more than two times within the first 24 hours

Adhesive performance on plastic packages is primarily a function of surface contact or wet-out. If surface contaminants such as plastic mold release oils are present, this will prevent contact and/or bonding to the surface. Make sure all surfaces are clean and dry prior to applying BOND PLY materials.