BERGQUIST® brand materials are the world's most trusted thermal management products. Part of Henkel Corporation since 2014, BERGQUIST is backed by Henkel's expansive global footprint, state-of-the-art R&D resource and unmatched service and support network. BERGQUIST thermal management solutions provide reliability-enhancing, heat-dissipating performance in multiple markets and applications including automotive, consumer, industrial, telecom/datacom, computing, and communication, among others. 

Henkel's BERGQUIST Thermal Management Solutions

Thermal Interface Materials

Thermal solutions in multiple forms, configurations and chemistry platforms that control heat in a variety of electronic applications.
 

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Airflow

Acoustically-superior airflow systems maximize the effectiveness of active air cooling and offer streamlined designs for application adaptability.
 

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Thermal Clad Insulated Metal Substrate (IMS®)

TCLAD® insulated metal substrates provide an effective alternative to conventional FR4 PCBs for higher power surface mount applications.

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Exploring Henkel's BERGQUIST brand of Thermal Interface Materials (TIM)

  • 방열 갭 필러

    열전도성 액상 갭 필링 재료

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  • 열 GAP PAD

    에어 갭을 메우고 열전도성을 향상시킵니다.

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  • SIL PAD

    열 계면의 청결과 효율성을 높이는 전기 전도성 및 비전도성 방열 재료

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  • 열전도성 접착제

    High structural bond strength in severe environments

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