LOCTITE® ABLESTIK TE 3530
특징 및 이점
This 1-part, low viscosity, thermally-conductive epoxy adhesive is specially formulated to bond heat dissipation components, and can be applied using automatic syringe dispensing.
When you need a highly thermally-conductive adhesive to bond heat sensitive materials, try LOCTITE® ABLESTIK TE 3530. This high dielectric, low-viscosity material has a low temperature cure, and is perfect for use in sensor attach and die attach applications. It can be applied using an automatic syringe dispensing method.
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