BERGQUIST® GAP PAD® TGP 1350
Known as Gap Pad® 1450
Features and Benefits
This silicone, thermally-conductive and reworkable gap pad is highly conformable, easily compressable, and is reinforced with a PEN film for rework and improved resistance to puncture and tear.
When you need a thermally conductive gap pad for fragile components, try BERGQUIST® GAP PAD TGP 1350. This silicone-based pad is highly conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to puncture and tear. It’s highly durable and UL 94 V-0 compliant.
- Thermal conductivity: 1.3 W/m-K
- Easily compressible (shore OO 30)
- Highly durable
- UL94 V-0 compliant
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
Carrier type | PEN film |
Color | Light pink |
Operating temperature | -60.0 - 150.0 °C |
Thermal conductivity | 1.3 W/mK |