LOCTITE® ABLESTIK ATB 110U

Known as EASY STACK ATB-110U, 12-INCH

Features and Benefits

LOCTITE ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
LOCTITE® ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
  • Fast cure
  • Non-conductive
  • Thin bondline
  • Excellent gap filling ability
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Technical Information

Adhesive film thickness 10.0 µm
Carrier film thickness 85.0 µm
Dicing tape diameter 12.0
Extractable ionic content, Chloride (CI-) 10.0 ppm
Extractable ionic content, Fluoride (F-) 10.0 ppm
Extractable ionic content, Potassium (K+) 10.0 ppm
Extractable ionic content, Sodium (Na+) 10.0 ppm
Hot die shear strength 2.0 kg-f
RT die shear strength 40.0 kg-f
Tensile modulus, DMTA @ 250.0 °C 2.0 N/mm² (230.0 psi )
Wafer diameter 12.0
Weight loss, @ 300.0 °C <1.0 %