10.0 W/m-K BERGQUIST® LIQUI FORM Gel Tackles Heat Management Challenges in High Bandwidth Systems
Irvine, CA – Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000. The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.
Larger, higher-power devices such as ASICs and FPGAs are the norm in 5G telecom infrastructure gear, data center switches, routers and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and digitalization requirements, higher wattage thermal output must be controlled to deliver dependable performance. BERGQUIST® LIQUI FORM TLF 10000 provides 10.0 W/m-K thermal conductivity and is ideal for applications where environments can be extreme or unpredictable and reliability is critical