LOCTITE® ABLESTIK ATB 125
Known as EASY STACK ATB-125-12
Features and Benefits
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LOCTITE® ABLESTIK ATB 125 adhesive film is formulated for use in wafer lamination proceses. It combines process ease with the proven reliability of a hybrid chemistry-based die attach material.
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Technical Information
Adhesive film thickness | 25.0 µm |
Carrier film thickness | 85.0 µm |
Dicing tape diameter | 12.0 |
Extractable ionic content, Chloride (CI-) | 10.0 ppm |
Extractable ionic content, Potassium (K+) | 2.0 ppm |
Extractable ionic content, Sodium (Na+) | 8.0 ppm |
Hot die shear strength | 2.0 kg-f |
RT die shear strength | 15.0 kg-f |
Tensile modulus, DMTA @ 250.0 °C | 8.6 N/mm² (1250.0 psi ) |
Wafer diameter | 12.0 |
Weight loss, @ 300.0 °C | 1.0 % |