LOCTITE® ABLESTIK ABP 8415
Features and Benefits
LOCTITE ABLESTIK ABP 8415, Epoxy, Die attach
LOCTITE® ABLESTIK ABP 8415 adhesive is designed for die attach applications.
- Wire bondable
- Good adhesion
- One component
- Solvent-free
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 60.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 210.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 35.0 °C |
| Thixotropic index | 3.25 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 16000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8415
LOCTITE ABLESTIK ABP 8415, Epoxy, Die attach