As confidential transaction capabilities become integrated into mobile devices, security and reliability play an even more critical role in device development. The rollout of point-of-sale payment options on smartphones has accelerated the need for unique customer identification via fingerprint recognition. To facilitate this functionality, fingerprint sensors are now an integral part of the latest generation mobile devices, and the market for these sensors is growing exponentially. Henkel delivers far more than highly-capable adhesives; our technology solutions, application expertise and global distribution network put advanced sensor development at your fingertips.
Fingerprint Sensors
Adhesive Solutions for Fingerprint Sensors
Glass to IC Attach
Adhesive to Attach Glass to Sensor Die
Key Material Properties
- High adhesion
- Low temperature cure
- Low moisture absorption
- Thin bond line control
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Electrically Conductive Adhesives
Solder Alternative to Attach Metal Ring to Metal Plate
Key Material Properties
- Good electrical connection
- Low temperature cure
- Fast cure
- High adhesion
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Sensor Die Attach Materials
Key Material Properties
- High adhesion
- Low temperature cure
- Low warpage
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Underfills
Key Material Properties
- Good flow ability
- Flexible product to accommodate stress
- High adhesion
- High reliability
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Wirebond Sealing/Encapsulants
Key Material Properties
- Low temperature cure
- Suitable modulus
- Pass reliability
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Reinforcement of FPC
Key Material Properties
- Flexible product to accommodate stress
- High adhesion
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Ring Attach Materials
Key Material Properties
- Good adhesion
- UV or low-temperature cure
- Good gap fill capability
- Low bleed
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Hard Coating Materials
Key Material Properties
- High hardness >5H
- Water resistant
- Passes sweat or salt test
- Gloss finish
- Void free
- Scratch resistant
- Chemical resistant
- UV light resistant
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Resources for Fingerprint Sensors
Brochure: Fingerprint Sensors
Whitepaper: Personal Identity Verification Made Possible by Advanced Materials
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