Image Sensors

Increased pixel counts are dictating larger image sensor dies. Henkel’s complete portfolio of low-temperature cure, low-stress, low-outgassing die attach pastes provide excellent performance and high throughput, while minimizing stress and warpage.

Key Material Properties

• Low-temperature cure (80°C)
• Low-stress die attach
• Low outgassing
• Faster cure (Improved throughput)
• Low halogen / RoHS-compliant

Paste

Film

Electrically conductive adhesives (ECAs) are integrated into several areas of auto-focus camera modules. Click here to learn more about the broad capabilities of Henkel’s ECA portfolio.

Key Material Properties

• Good electrical conductivity
• Fast curing
• High and stable adhesion
• Low-temperature cure
• Long pot life
• Low halogen / RoHS-compliant

House Bonding Adhesives

Bonding the lens holder to the substrate requires different adhesive characteristics depending on the type of camera module being assembled. For fixed-focus cameras, a traditional thermal-cure, nonconductive house bonding adhesive is the preferred approach. More advanced auto-focus modules, however, require a different technique – particularly as pixels and lens quantity increase. For this application, active alignment is employed and requires dual-cure adhesives with UV and thermal-cure capabilities. Henkel’s house bonding materials – whether thermal only or dual-cure formulations – have excellent bonding capabilities for a variety of substrates, which is critical as the industry incorporates both liquid crystal polymer (LCP) and polyphthalamide (PPA) holder materials.

IR Filter Bonding Adhesives

Bonding of the IR filter to the substrate requires a strong, yet flexible, material to accommodate fast, high-adhesion curing with the ability to absorb stress. Though most substrates are ceramic, substrate materials can vary depending on manufacturing preferences and final product function. Because of this, an IR bonding material should be able to adhere to a variety of substrates. Along with excellent UV-cure characteristics, Henkel’s IR filter bonding adhesives have been designed to accommodate both fixed- and auto-focus module substrate adhesion requirements for exceptional in-field operation.

Lens Bonding Adhesives

Lens locking adhesives also play a critical role in the function of the camera module. Effective bonding of the lens barrel to the lens holder requires specialized adhesives that accommodate low-temperature processing. With very rapid UV cure and handling strength, a high thixotropic index to reduce liquid migration and unwanted contamination, and the ability to enhance load-bearing and shock-absorbing characteristics, Henkel’s UV lens bonding adhesives deliver the strength, reliability and performance required – all without high-temperature processing concerns.

Key Material Properties

• High adhesion to LCP, PA, PPA, etc.
• Low-temperature cure (80°C)
• Faster cure (Improved throughput)
• Dual-cure (UV & thermal)
• Low halogen / RoHS-compliant

To safeguard flip-chip image die applications, side fill underfill provides bump reinforcement during reliability testing and while in use. The capability of the underfill is critical, with controlled flow essential to material containment and to avoid image sensor contamination. In addition to the flip-chip reinforcement, underfill is also used to protect the connection of the camera module to the PCB.

Key Material Properties

• Controlled flow
• High thixotropic index
• Good bump coverage
• Good fillet capability
• Low-temperature cure
• Long pot life
• Low halogen / RoHS-compliant