LOCTITE® ABLESTIK ICP 9000
Features and Benefits
LOCTITE ABLESTIK ICP 9000 is a single component, silver-filled, semi-sintering liquid adhesive that is a solder replacement and specially designed for use in high power and high temperature assembly of electronic devices.
LOCTITE® ABLESTIK ICP 9000 is an electrically conductive material that offers high adhesion and low stress for high end power IC packages including, SiC power devices as well as GaAs and GaN die transistors. This product is formulated to offer good workability and no resin bleed-out, as well as high thermal stability. LOCTITE ABLESTIK ICP 9000 is highly reliable and the thermal performance is comparable to solder paste products.
- Electrically conductive
- No resin bleed-out
- Good workability and sintering properties when used on Ag, PPF, Au and Cu substrates
- High thermal stability
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Color | Silver |
| Cure schedule, @ 200.0 °C | 1.0 hr. |
| Cure type | Heat cure |
Frequently Asked Questions
Is there anything that can be done to speed up the thawing of a syringe?
Do I need to have a clean substrate surface prior to adhesive assembly?
What is the preferred method to automatically dispense ECA's?
LOCTITE® ABLESTIK ICP 9000
LOCTITE ABLESTIK ICP 9000 is a single component, silver-filled, semi-sintering liquid adhesive that is a solder replacement and specially designed for use in high power and high temperature assembly of electronic devices.