LOCTITE® ABLESTIK C860-1J
Known as ECCOBOND C-860-1J
Features and Benefits
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LOCTITE ABLESTIK C860-1J, Epoxy, Assembly
LOCTITE® ABLESTIK C860-1J silver filled epoxy adhesive is specially suited for die and component bonding in microelectronic applications.
- One component
- Electrically conductive
- Good thermal stability
- Long room temperature shelf life
Documents and Downloads
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LOCTITE® ABLESTIK C860-1J
LOCTITE ABLESTIK C860-1J, Epoxy, Assembly