LOCTITE® ABLESTIK 965-1L
Features and Benefits
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach
LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
- Electrically conductive
- Stress absorbing
- Low levels of contaminants
- Void-free bondline with minimal bleed
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 50.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 190.0 ppm/°C |
| Color | Silver |
| Cure schedule, @ 150.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 72.0 °C |
| Hot die shear strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 0.6 kg-f |
| RT die shear strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 10.0 kg-f |
| Thermal conductivity | 3.0 W/mK |
| Thixotropic index | 4.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12000.0 mPa·s (cP) |
| Volume resistivity | ≤ 0.0005 Ohm cm |
LOCTITE® ABLESTIK 965-1L
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach