BERGQUIST TGR 4000

Terkenal sebagai TIC 4000

fitur dan keuntungan

BERGQUIST TGR 4000 is a gray, single component, thermal interface compound formulated for use between a computer processor and a copper-based heat sink.
BERGQUIST® TGR 4000 is a thermally conductive, grease compound that flows to produce the lowest thermal impedance by wetting out the thermal interface surface. This product requires pressure during assembly to start the flow but will not drip. Typical applications include higher performance computer processes since traditional screw fastening or clamping methods provide adequate force to optimize thermal performance.
  • High thermal conductivity: 4.0 W/m-K
  • Exceptional thermal performance: 0.19°C/W at 50 psi
  • Designed for use with copper heat sinks
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