LOCTITE ABLESTIK QMI529HT-2A1

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LOCTITE ABLESTIK QMI529HT-2A1, BMI/Acrylate, Die attach
LOCTITE® ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
  • Electrically conductive
  • Void-free bondline
  • Thermally conductive
  • Hydrophobic
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Teknis Lembar Data
LOCTITE ABLESTIK QMI529HT-2A1
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 4.8
Koefisien Muai Termal (CTE) 53.0 ppm/°C
Koefisien Muai Termal (CTE), Above Tg 156.0 ppm/°C
Konduktivitas Termal 6.0 W/mK
Suhu Transisi Kaca (Tg) 3.0 °C
Tipe Pengeringan Heat Cure
Viskositas 185000.0 mPa.s (cP)