LOCTITE ABLESTIK ABP 2035SCR
fitur dan keuntungan
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
- Non-conductive
- Single component
- Fast cure
- Low cure temperature
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Indeks Tiksotropik | 4.0 |
| Koefisien Muai Termal (CTE) | 50.0 ppm/°C |
| Koefisien Muai Termal (CTE), Above Tg | 135.0 ppm/°C |
| Konduktivitas Termal | 1.0 W/mK |
| Suhu Transisi Kaca (Tg) | 118.0 °C |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa.s (cP) |
LOCTITE ABLESTIK ABP 2035SCR
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive