LOCTITE® ABLESTIK 2030SCM

Features and Benefits

LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach
LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
Read More

Technical Information

Applications Die attach
Cure type Heat cure
Thermal conductivity 2.3 W/mK
Thixotropic index 4.6
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 14000.0 mPa·s (cP)