Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its enabling impact on some of the most demanding package designs used in the automotive, industrial, and high-performance computing sectors.
“As the SEMICON Taiwan show organizers have emphasized,” comments Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur, “the semiconductor industry is central to nearly all technology development and to solving some of the world’s biggest challenges. Henkel is a key contributor to this progress, delivering cutting-edge semiconductor packaging materials for high reliability automotive packaging, AI and high-performance computing, and evolving industrial applications.”
As a leader in die attach pastes and films and having engineered several groundbreaking advanced packaging formulations, Henkel’s objective at SEMICON Taiwan is to introduce invited guests to materials that are helping semiconductor technologists respond to microelectronics advancement, including: