Ensuring Large Die Durability in AI and HPC Advanced Packages

Protection is performance-critical, processability is production-vital

The rapid advancements in artificial intelligence (AI) and high-performance computing (HPC) have underscored the critical role of advanced semiconductor packaging. Over the past decade, substantial progress in 2.5D and 3D heterogeneous integration has been achieved, enhancing I/O capacity, performance, cost-efficiency, power reduction, and signal speed. These developments have been crucial for handling massive data processing demands. As these technologies evolve, ensuring the reliability and protection of increasingly large and complex die within these packages has become paramount.

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This whitepaper discusses:

Challenges of Large Die Packages: Exploring the complexities and issues that arise with advanced packaging solutions.
Importance of Die Protection: The critical role of protective materials in maintaining the integrity and functionality of semiconductor packages.
Innovations in Underfill Materials: An in-depth look at the latest developments, specifically the introduction of Loctite Eccobond UF9000AE, which is setting new standards for underfill performance.

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Ensuring Large Die Durability in AI and HPC Advanced Packages

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