In this podcast episode, we're delving into the complex world of thermal interface materials (TIMs) in electronic system design, with a specific focus on applications dealing with thicker gaps. Our exploration begins with the challenge posed by insulating air gaps in heat sinks and the intriguing dilemma of choosing between liquid and pad-based TIMs. We'll define what qualifies as a "thick" gap, compare the advantages of thermal pads and liquid gap fillers, and dissect the differences between two-part liquid and gel TIMs. Moving beyond the liquid vs. pad debate, our discussion will underscore the multifaceted considerations, including resin chemistry and thermal conductivity, that play a pivotal role in guiding TIM selection for optimal heat dissipation in electronic devices.
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