Sustainability Takes Partnerships

Henkel Provides Reliable Thermal, Protecting & Bonding Solutions

Reliable Thermal, Protecting, & Bonding Solutions for Power Conversion Applications

Developer and manufacturer of market-leading BERGQUIST® brand thermal management solutions.

In this podcast episode, we're delving into the complex world of thermal interface materials (TIMs) in electronic system design, with a specific focus on applications dealing with thicker gaps. Our exploration begins with the challenge posed by insulating air gaps in heat sinks and the intriguing dilemma of choosing between liquid and pad-based TIMs. We'll define what qualifies as a "thick" gap, compare the advantages of thermal pads and liquid gap fillers, and dissect the differences between two-part liquid and gel TIMs. Moving beyond the liquid vs. pad debate, our discussion will underscore the multifaceted considerations, including resin chemistry and thermal conductivity, that play a pivotal role in guiding TIM selection for optimal heat dissipation in electronic devices.

Listen to the podcast and/or read the article to learn more. 

In an era where sustainability is gaining paramount importance, forward-thinking organizations are realizing that sustainable product design is more than a trend—it's a transformative strategy. Research shows that most of a product's environmental impacts are determined during the initial design phase. This realization underscores the crucial role of R&D managers in driving sustainable impact. To navigate the complex landscape of sustainable design, companies must foster a culture that encourages creative thinking, challenges conventions, and embraces a holistic approach to product development. In this podcast session, our expert Yassine Chino explores the key principles and steps involved in unlocking sustainable design, emphasizing the pivotal role of R&D managers in this endeavor.

 With our expert Shelby Shevik

Customer Challenges

• A new Programmable Logic Controller (PLC) design required a robust thermal management solution with no outgassing risk.
• As the system can be used in a variety of machines and production environments, the thermal materials must be conducive to many conditions.
• The customer requested the use of a silicone-free thermal solution to avoid silicone contamination, but wanted to maintain the stress control and heat benefits generally consistent with silicone-based thermal interface materials (TIMs).

Customer Challenges

• A new electronic control unit (ECU) design incorporates a large processor IC that requires excellent heat dissipation for optimized function. 
• The system is sensitive and outgassing minimization is necessary to avoid interference with other components.