LOCTITE® ECCOBOND UF 1173
Features and Benefits
Epoxy-based formulation for a uniform and void-free encapsulant underfill.
When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE® ECCOBOND UF 1173™. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE® ECCOBOND UF 1173™ has a long pot life and exhibits low-CTE properties to improve the bond strength and stability.
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Technical Information
| Color | Black |
| Cure type | Heat cure |
LOCTITE® ECCOBOND UF 1173
Epoxy-based formulation for a uniform and void-free encapsulant underfill.